so, my rog phone 2 died and i had to replace motherboard. while i was taking the old one out i noticed a THICK layer of dried thermal paste on top of the cpu and heatsink.

i decided to put some 1mm thermal pad on top of the cpu and thermal paste, nonconductive, around soc on those tiny components. paste is important or it will never start cooling off after you play games or run benchmarks. both thermal pad and paste were your generic type with not so great heat conductivity.

i also tried making a copper shim but it seems like it didn't work that well or i messed up something.

i know people say there is a patch for overheating phones. but the matter of fact is that there is a big gap between the soc and heatsink and they didn't use thermal pads, or that thick paste that can be used instead of pads, but they just squeezed a big blob of thermal paste and called it a day.

and i'm on android 10, which overheated phones that were just fine on android 9.