Layout Example

The image is from the TI BQ24079 Battery PMIC datasheet. Above the example it states: "Use a single-point ground technique incorporating both the small signal ground path and the power ground path"

So, help me out here, if you would:

Is there a Ground(VSS) on the Top Layer, AND the bottom layer?

Is this even a 2 layer design, or is it multi-layer? I only say so because it's clear that there are thermal vias beneath the IC, and larger versions of the same figure on all the copper pours labeled VSS, which I'm assuming are there to connect the two Ground Planes, i.e., "Single Point" Ground...

What say you, those wiser than I on the subject?

Thank you in advance.