So I was reading this interesting article, about 3D printing and IC develompment: https://www.nano-di.com/blog/2019-3d-printing-integrated-circuits-whats-possible-now-and-in-the-future

This is for me the core of the article:

In any manufacturing process, the cost structure involved in manufacturing is an important driver of the price of a finished device. Integrated circuits succeed or fail based on the cost of the die on the wafer—when more dies can be placed on a single wafer, the costs per device decreases. The cost structure of integrated circuit manufacturing is responsible for the high costs of highly specialized, low-volume integrated circuits. An excellent example can be found in the defense industry, where the cost of a single FPGA for a complex system can reach tens of thousands of dollars.

The unique cost structure of 3D printed devices changes this economic dynamic. 3D printed integrated circuits do not need to be produced on a wafer and can even be manufactured individually. Because 3D printed devices can be produced with predictable fabrication time, and the cost structure is complexity agnostic, the costs involved in 3D printing electronics depends on the weight of the materials used. This makes 3D-printed integrated circuits highly cost competitive for low-volume production compared to devices produced on semiconductor wafers with standard processes.

I would like to know your thoughts.