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SMD thermal design for a headphone amplifier
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This is a class A headphone amplifier. U1 is an LT1965 with a DDPAK-5 package and Q3 and Q6 are BCP56s with an SOT-223 package. In LTSpice, U1 draws about 610mWrms, and I have specced an Aavid 5733 on U1. The transistors each draw about 400mWrms. R7-R12/R25-R30 draw about 390mW, R13-18/R31-R36 draw about 130mW, and I have specced 250mW 1206 resistors in those positions. Is this amount of heatsinking enough for everything, or do I need to improve the thermal design?
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