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IC popcorning even after baking to remove moisture. What to do now?
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I've unfortunately come into a situation where an expensive IC is not staying on the pcb while reflowing. Even after baking at 125 for 48 hours, it's still popping off. I've confirmed that the factory is reflowing at the proper temperatures.
Is the part filled with too much moisture to be salvageable at this point, or will baking it more solve the issue?
Edit to add: It's TQFP-48. It's only expensive right now because of the chip shortage. I purchased from a vendor I do not normally buy from.
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